A collective manufacturing technology suitable for mass production of lightweight, compact, waterproof electronic components.
Mass production technology for compact electronic components with high dustproof and waterproof performance, packaging press parts, LED elements, sensors, ICs, and more in a unique structure!
This is a unique packaging technology designed to achieve electronic components with excellent dust and water resistance. It enables miniaturization, which was a challenge in traditional methods using lead frames. 【Features】 - Dust and Water Resistance The core components can be sealed through lamination, achieving dust and water resistance. (The IP level varies depending on the selected components and the packaging structure suited for the application.) - Improved Productivity This technology allows for the lamination of a large number of core components at once, followed by dicing to produce individual pieces, enabling the manufacturing of thousands to tens of thousands of electronic components simultaneously. This significantly enhances productivity compared to traditional packaging using lead frames. Additionally, by sealing multiple core components in a single product, the added value of the product can also be improved. Furthermore, some optical components can be produced without molds, allowing for shorter lead times. - Miniaturization By replacing the lead frame with a circuit board, the line width can be narrowed to around several tens of micrometers. This also allows for the miniaturization of the components themselves. For example, in our tactile switches, we have achieved a 20% reduction in size compared to conventional products.
